Given the complexity of MEMS structures and their sensitivity to fabrication variations, FEM plays a crucial role in predicting performance, optimizing designs, and minimizing costly prototyping iterations. We conduct in-depth analyses of stress, deformation, modal frequencies, and multiphysics interactions to ensure the reliability and efficiency of MEMS devices before fabrication. By performing high-resolution FEM simulations, even at the wafer scale, and applying optimization algorithms to refine device structures, we achieve the most efficient design. This accelerates the prototyping process, reducing development time while enhancing performance and manufacturability. For this we use both COMSOL and Ansys.
At IonSilicon, we create MEMS layouts with a deep understanding of fabrication constraints. We leverage advanced CAD tools and process design kits (PDKs) to translate complex device architectures into precise mask layouts. Given the intricate nature of MEMS, we carefully address challenges such as minimizing parasitics, ensuring uniform etching, and optimizing layer alignments. By integrating design-rule checks (DRC) and process simulations early in the workflow, we mitigate fabrication risks and improve yield. Our iterative approach, combined with close collaboration with foundries, allows us to refine layouts efficiently, balancing innovation with manufacturability.For this we use Klayout for design and Cadence.